The family of systems offer the flexibility of several techniques in a single chamber, each system in the range featuring a universal 'quick-change' source flange which can be configured for specific deposition techniques or combination of techniques including magnetron, thermal, e-beam or combination sources which provide a truly multi-technique, multi-deposition system ideal for both small scale production and R&D prototyping.

In addition, each system configuration has a wealth of viewports and equipment ports for ancillary instruments such as ion sources for sample cleaning, thickness monitors and load lock entry. A comprehensive PC control and data acquisition system is available as an option and also allows ancillary techniques and devices to be fully integrated.

Efficient water cooling and differentially pumped seals guarantee a base pressure of E-9 mbar which, together with sample manipulator options, provide the widest possible access to substrate conditions, including full 360 degree rotation with stage heating and cooling.

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